Recently, the South Korean semiconductor manufacturer Samsung preempted TSMC, the leading foundry, the news of mass production of 3 nm has aroused great concern in the industry. The latest news is that Samsung has officially announced the news of mass production of 3nm chips.

Today (June 30), Samsung announced through its WeChat public number "Samsung Semiconductor and Display Official", based on 3nm Gate-All-AroundT (GAA) process node chip has begun initial production, the first will be applied to high-performance, low-power computing field of semiconductor chips, and plans to expand it to the field of mobile processors.

Compared with Samsung's 5nm process, Samsung's first generation 3nm process can make power consumption reduced by 45%, performance improved by 23%, the chip area reduced by 16%; Samsung said that the future second generation 3nm process will make power consumption reduced by 50%, performance improved by 30%, the chip area reduced by 35%.

As for 3nm customers, some media reports said that sources revealed that Samsung said it already has customers ordering capacity, including virtual currency mining machine chip design company Shanghai PanSemi (PanSemi), as well as mobile processor maker Qualcomm (Qualcomm), etc., but Qualcomm will be cast depending on the situation.

From the point of view of time nodes, Samsung 3nm technology mass production time is indeed ahead of TSMC.

According to TSMC's recent process technology development blueprint and future plans shared at the North America Session of the Technology Symposium, its initial 3nm node (N3) is expected to begin mass production in the second half of this year and be delivered to customers from early next year. In addition, TSMC will introduce a variety of N3-derived manufacturing processes in the coming years.

For the 2nm process process, TSMC has revealed that the N2 process node will use the GAAFET architecture for the first time and is planned to be in production in 2025.