STMicroelectronics announced on June 29, 2022 the ST4SIM-201 embedded SIM (eSIM) chip for machine-to-machine communication (M2M), which is compliant with the latest 5G network access and M2M security specifications, as well as flexible remote activation management standards. 

The ST4SIM-201 is compliant with ETSI/3GPP standard version 16 and can connect to 5G Standalone (SA) networks, as well as 3G and 4G networks, and Low Power Wide Area (LPWA) network technologies, such as Long Term Evolution of Machines (LTE-M) networks and Narrowband Internet of Things (NB-IoT). 

The ST4SIM-201 is certified to the latest GSMA eUICC M2M specification, SGP.02 version 4.2, which supports remote SIM card issuance to simplify card activation and maintenance. The new product is the first SIM card chip to implement GSMA eUICC Security Assurance (eSA) using the SGP.05 eUICC Protection Profile specification version 1.1. With this SIM chip, users can change carriers remotely without the need to connect the chip, thereby simplifying logistics and distribution, increasing application flexibility, and helping to reduce the cost of ownership over the life of the card. In addition, users can use the test profiles and emergency profiles specified in the SGP.02 specification version 4.2. 

The ST4SIM-201 is an industrial grade product that is ideally suited for IoT applications and any device that requires cellular connectivity, including smart meters, asset trackers, health condition monitors, policing devices, telemetry devices, security systems, and other smart IoT devices. 

Compliance with the ETSI specification ensures that the chip supports energy efficiency enhancements for M2M applications, including Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX) mode, which leverages idle mode. The ST4SIM-201 also supports ETSI-specified suspend/resume commands to improve power management efficiency. 

The ST4SIM-201 is available in a variety of package sizes to meet different customer requirements, including 5mm x 6mm DFN8 dual flat leadless packages and wafer-level chip packages (WLCSP), as well as standard 2FF, 3FF and 4FF plug-in cards