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LPC1850FET180,551

FREE-SKY (HK) ELECTRONICS CO.,LIMITED / 06-25 10:35

LPC1850FET180,551 Product Details

The LPC185x/3x/2x/1x are Arm® Cortex®-M3 based microcontrollers for embeddedapplications. The Arm Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.

The LPC185x/3x/2x/1x operate at CPU frequencies of up to 180 MHz. The ArmCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ArmCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.

The LPC185x/3x/2x/1x include up to 1 MB of flash and 136 kB of on-chip SRAM, 16 kB ofEEPROM memory, a quad SPI Flash Interface (SPIFI), a State Configurable Timer (SCT)subsystem, two High-speed USB controllers, Ethernet, LCD, an external memorycontroller, and multiple digital and analog peripherals.

Feature

  • Processor core

    • Arm Cortex-M3 processor, running at CPU frequencies of up to 180 MHz

    • Arm Cortex-M3 built-in Memory Protection Unit (MPU) supporting eight regions

    • Arm Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC)

    • Non-maskable Interrupt (NMI) input

    • JTAG and Serial Wire Debug, serial trace, eight breakpoints, and four watch points

    • Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support

    • System tick timer

  • On-chip memory

    • Up to 1 MB on-chip dual bank flash memory with flash accelerator

    • 16 kB on-chip EEPROM data memory

    • 136 kB SRAM for code and data use

    • Multiple SRAM blocks with separate bus access

    • 64 kB ROM containing boot code and on-chip software drivers

    • 64 bit of One-Time Programmable (OTP) memory for general-purpose use

  • Clock generation unit

    • Crystal oscillator with an operating range of 1 MHz to 25 MHz

    • 12 MHz internal RC oscillator trimmed to 2 % accuracy over temperature andvoltage (1 % accuracy for Tamb = 0 °C to 85 °C)

    • Ultra-low power RTC crystal oscillator

    • Three PLLs allow CPU operation up to the maximum CPU rate without the need fora high-frequency crystal. The second PLL can be used with the High-speed USB,the third PLL can be used as audio PLL

    • Clock output

  • Configurable digital peripherals

    • State Configurable Timer (SCT) subsystem on AHB

    • Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs andoutputs to event driven peripherals like timers, SCT, and ADC0/1

  • Serial interfaces

    • Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to52 MB per second

    • 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for highthroughput at low CPU load. Support for IEEE 1588 time stamping/advanced timestamping (IEEE 1588-2008 v2)

    • One High-speed USB 2.0 Host/Device/OTG interface with DMA support andon-chip high-speed PHY (USB0)

    • One High-speed USB 2.0 Host/Device interface with DMA support, on-chipfull-speed PHY and ULPI interface to an external high-speed PHY (USB1)

    • USB interface electrical test software included in ROM USB stack

    • Four 550 UARTs with DMA support: one UART with full modem interface; oneUART with IrDA interface; three USARTs support UART synchronous mode and asmart card interface conforming to ISO7816 specification

    • Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controllerexcludes operation of all other peripherals connected to the same bus bridge

    • Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMAsupport

    • One Fast-mode Plus I²C-bus interface with monitor mode and with open-drain I/Opins conforming to the full I²C-bus specification. Supports data rates of up to1 Mbit/s

    • One standard I²C-bus interface with monitor mode and standard I/O pins

    • Two I²S interfaces with DMA support, each with one input and one output

  • Digital peripherals

    • External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,and SDRAM devices

    • LCD controller with DMA support and a programmable display resolution of up to1024H x 768V. Supports monochrome and color STN panels and TFT color panels;supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixelmapping

    • SD/MMC card interface

    • Eight-channel General-Purpose DMA controller can access all memories on theAHB and all DMA-capable AHB slaves

    • Up to 164 General-Purpose Input/Output (GPIO) pins with configurablepull-up/pull-down resistors

    • GPIO registers are located on the AHB for fast access. GPIO ports have DMAsupport

    • Up to eight GPIO pins can be selected from all GPIO pins as edge and levelsensitive interrupt sources

    • Two GPIO group interrupt modules enable an interrupt based on a programmablepattern of input states of a group of GPIO pins

    • Four general-purpose timer/counters with capture and match capabilities

    • One motor control PWM for three-phase motor control

    • One Quadrature Encoder Interface (QEI)

    • Repetitive Interrupt timer (RI timer)

    • Windowed watchdog timer

    • Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytesof battery powered backup registers

    • Event recorder with three inputs to record event identification and event time; canbe battery powered

    • Alarm timer; can be battery powered

  • Analog peripherals

    • One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s

    • Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.Up to eight analog channels total. Each analog input is connected to both ADCs

  • Unique ID for each device

  • Power

    • Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip internal voltage regulator forthe core supply and the RTC power domain

    • RTC power domain can be powered separately by a 3 V battery supply

    • Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deeppower-down

    • Processor wake-up from Sleep mode via wake-up interrupts from variousperipherals

    • Wake-up from Deep-sleep, Power-down, and Deep power-down modes viaexternal interrupts and interrupts generated by battery powered blocks in the RTCpower domain

    • Brownout detect with four separate thresholds for interrupt and forced reset

    • Power-On Reset (POR)

  • Available in LQFP208, LBGA256, LQFP144, and TFBGA100 packages

Target Applications
  • Industrial

  • Consumer

  • White goods

  • RFID readers

  • e-Metering

Technical Parameters

  • Core

  • ARM Cortex M3

  • Data Bus Width

  • 32 bit

  • Maximum Clock Frequency

  • 150 MHz

  • Program Memory Size

  • 128 B

  • Data RAM Size

  • 200 KB

  • On Chip ADC

  • Yes

  • Operating Supply Voltage

  • 2.2 V to 3.6 V

  • Maximum Operating Temperature

  • + 85 C

  • Package / Case

  • TFBGA-180

  • Mounting Style

  • SMD/SMT

  • A/D Bit Size

  • 10 bit

  • A/D Channels Available

  • 8

  • Data ROM Size

  • 64 KB

  • Interface Type

  • CAN, I2C, SPI, UART, USB

  • Length

  • 12.575 mm

  • Minimum Operating Temperature

  • - 40 C

  • Number of Programmable I/Os

  • 118

  • Number of Timers

  • 6

  • Packaging

  • Tray

  • Processor Series

  • LPC1850

  • Program Memory Type

  • SRAM

  • Factory Pack Quantity

  • 189



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