Logic gates are the basic building blocks of digital circuits because they allow electronic systems to process binary signals, make decisions, and control other parts of a system. Although their Boolean functions are simple, real logic design involves more than knowing symbols and truth tables. You also need to understand voltage levels, logic families, propagation delay, output drive, loading, and power. This article explains the main logic gates, shows how truth tables and Boolean expressions are turned into working circuits, compares NAND and NOR implementations, examines a practical 3.3 V-to-5 V logic interface, and discusses when discrete gates, MCUs, CPLDs, or FPGAs are the better choice.

Figure 1. Common Distinctive-Shape Symbols for AND, NAND, OR, NOR, NOT, XOR, and XNOR Gates.
A logic gate is a digital circuit that applies a Boolean function to one or more input signals and produces a corresponding output. Digital logic uses two abstract states, normally represented as 0 and 1, or LOW and HIGH. These states allow electronic circuits to make decisions, process binary information, and control other parts of a digital system.
Logical 0 and 1 should not be treated as exact voltage values. In physical hardware, they are represented by voltage ranges that the device recognizes as LOW or HIGH. The acceptable input and output levels depend on the logic device, supply voltage, and logic family. This means a logic 1 is not necessarily exactly equal to the supply voltage, and a logic 0 is not necessarily exactly 0 V. The specific voltage limits and compatibility requirements are discussed later in the article.
When several gates are connected, the output of one gate can become the input of another. In combinational logic, the resulting output is determined by the present combination of input states. This basic input-processing-output relationship is the foundation for larger digital circuits, while the following sections explain how individual gate functions are represented, combined, and implemented in practical hardware.
The table below uses A and B for the inputs and Y for the output throughout. AND, OR, NAND, NOR, XOR, and XNOR are shown as two-input gates, while NOT uses only input A.
| Logic Gate | Operator / Notation | Boolean Expression | Output Condition | Common Uses |
| AND | · | Y = A·B | HIGH only when both A and B are HIGH | Interlocks, enable logic, multiple-condition control |
| OR | + | Y = A + B | HIGH when A, B, or both are HIGH | Alarm logic, multiple-condition control |
| NOT | Overbar or prime | Y = A = A′ | Produces the opposite logic state of A | Signal inversion, active-high/active-low conversion |
| NAND | Inverted AND | Y = A · B | LOW only when both A and B are HIGH | Universal logic, control circuits, memory logic |
| NOR | Inverted OR | Y = A + B | HIGH only when both A and B are LOW | Universal logic, latch circuits, inactive-condition detection |
| XOR | ⊕ | Y = (A ⊕ B) | HIGH when A and B are different | Binary addition, parity checking, difference detection |
| XNOR | Inverted XOR | Y = ¬ (A ⊕ B) | HIGH when A and B are the same | Equality comparison, matching logic |
| A | B | AND | OR | NOT A | NAND | NOR | XOR | XNOR |
| 0 | 0 | 0 | 0 | 1 | 1 | 1 | 0 | 1 |
| 0 | 1 | 0 | 1 | 1 | 1 | 0 | 1 | 0 |
| 1 | 0 | 0 | 1 | 0 | 1 | 0 | 1 | 0 |
| 1 | 1 | 1 | 1 | 0 | 0 | 0 | 0 | 1 |
A truth table becomes more useful when it is connected to a practical control requirement. Consider a conceptual machine-enable example. The machine should receive a RUN command only when the START command is active, the GUARD is closed, and no FAULT is present.
For this example, define the signals as follows: START = 1 when a start command is active, GUARD = 1 when the guard is closed, and FAULT = 1 when a fault is detected. The required output is RUN.
This example demonstrates Boolean logic only. A real machine safety function must use an appropriately designed and validated safety-related control system. This warning is important because ISO 13849-1:2023 covers the design and integration of safety-related parts of control systems that perform safety functions, rather than a simple ordinary gate example used only for illustration. [7]
The machine can run only when all three required conditions are satisfied:
• START = 1
• GUARD = 1
• FAULT = 0
Because the fault condition must be inactive, the FAULT signal must first be inverted before it is combined with the other conditions.
The truth table lists every possible combination of the three input signals.
| START | GUARD | FAULT | RUN |
| 0 | 0 | 0 | 0 |
| 0 | 0 | 1 | 0 |
| 0 | 1 | 0 | 0 |
| 0 | 1 | 1 | 0 |
| 1 | 0 | 0 | 0 |
| 1 | 0 | 1 | 0 |
| 1 | 1 | 0 | 1 |
| 1 | 1 | 1 | 0 |
Only one input combination produces RUN = 1: START and GUARD are both active while FAULT is inactive.
The required output can therefore be written as:
RUN = START · GUARD · ¬FAULT
Here, ¬FAULT represents the inverted fault signal. The dots represent AND operations. This expression states that all three conditions must evaluate to logic 1 before RUN becomes logic 1.
The Boolean expression can now be implemented with logic gates. First, the FAULT signal passes through a NOT gate to produce ¬FAULT. Then START, GUARD, and ¬FAULT feed a three-input AND gate. The output of that gate becomes RUN.
Conceptual gate-circuit diagram:

Figure 2. Machine Enable Logic Circuit Using START, GUARD, and Inverted FAULT Inputs
This completes the design flow:
Requirement → Truth Table → Boolean Expression → Gate Circuit
This method can be applied to many digital-control problems. Start by defining what each input state means, determine which combinations should activate the output, write the corresponding Boolean expression, and then implement that expression with suitable gates.
Using conventional gates, first define the two intermediate terms separately:
P = AB
Q = C
The final output is:
F = P + Q
Therefore,
F = AB + C
This implementation requires one AND gate, one NOT gate, and one OR gate. The longest input-to-output path passes through two gate stages, so the maximum logic depth is two.
Starting with:
F = AB + C
Apply De Morgan’s law:
F = AB · C
The first NAND gate produces:
P = AB
The second NAND gate produces:
F = PC
Substituting P:
F = AB · C
Therefore,
F = AB + C
Only two NAND gates are required, with a maximum logic depth of two gate stages.
The same Boolean function can be rewritten in product-of-sums form:
F = (A + C) (B + C)
First, use a NOR gate with both inputs connected to C to generate its complement:
Q = C + C
Therefore,
Q = C
The next two NOR gates produce:
P = A + Q
R = B + Q
The final NOR gate combines these two outputs:
F = P + R
Substituting P and R:
F = A + Q + B + Q
Applying De Morgan’s law:
F = (A + Q) (B + Q)
Since Q = C:
F = (A + C) (B + C)
This implementation requires four NOR gates and has a maximum logic depth of three gate stages.
All complements are grouped so the overbar covers the complete intended term, such as AB, A + C, and P + R, rather than only the final variable or symbol.
Logic-gate selection requires more than checking the Boolean function. The electrical parameters determine whether the gate can interface correctly with other devices, meet timing requirements, drive the intended load, and operate reliably under the expected power and temperature conditions.
| Parameter | What It Specifies | Why It Matters in a Real Circuit |
| Supply-voltage range Vcc | Specifies the voltage range over which the IC is designed to operate correctly. | The supply range must match the system power rails. Logic families can perform the same function while supporting different operating voltages. TI’s logic-family comparisons show substantial differences in supported and typical supply voltages. [1] |
| Input HIGH voltage VIH | The minimum input voltage guaranteed to be interpreted as logic HIGH. | The driving device must provide a HIGH output that meets or exceeds VIH under the specified operating conditions. |
| Input LOW voltage VIL | The maximum input voltage guaranteed to be interpreted as logic LOW. | The driving device must keep its LOW output at or below VIL. A steady voltage between the guaranteed VIL and VIH limits should not be assumed to represent a valid logic state. |
| Output HIGH voltage VOH | The minimum HIGH output voltage guaranteed at a specified source current and supply voltage. | VOH must remain high enough to meet the receiving device's VIH requirement. The guaranteed HIGH voltage can decrease as source current increases. |
| Output LOW voltage VOL | The maximum LOW output voltage guaranteed at a specified sink current and supply voltage. | VOL must remain below the receiving device's VIL limit. Increasing output loading can raise the LOW-state voltage. |
| Noise margin | Measures the voltage margin between guaranteed output levels and required input thresholds. The HIGH and LOW margins are: and. | Larger positive noise margins provide greater tolerance to coupled noise, ground shift, and other voltage disturbances. Use guaranteed VIL and VIH limits for the relevant operating conditions rather than typical values. |
| Output source and sink current | Specifies the current an output can source while HIGH or sink while LOW while still meeting its guaranteed or limits. | Output-current capability helps determine whether the gate can drive the connected loads without violating valid logic levels. Fan-out also depends on input current, capacitive loading, and timing. For the SN74LVC1G00, TI specifies ±24 mA output drive at Vcc; 3.3v;higher drive conditions are available at higher supply voltage. [5] |
| Input leakage current | Specifies the small current that can flow into or out of an input while it is held at a valid logic level. | Leakage contributes to DC loading and becomes important with high-resistance bias networks, many parallel inputs, or very low-power systems. |
| Capacitive loading CL | Represents the capacitance driven by the output, including receiving inputs, PCB traces, connectors, and parasitic capacitance. | Higher CL generally slows output transitions and can increase propagation delay and switching energy. Datasheet timing values should therefore be compared using equivalent load conditions. The SN74LVC1G00 datasheet, for example, specifies timing under defined capacitive-load conditions. [5] |
| Parameter | What It Specifies | Why It Matters in a Real Circuit |
| Propagation delay tpd | The time between an input transition and the corresponding output transition. Datasheets may specify separate low-to-high and high-to-low delays, such as tPLH and tPHL. | Delays accumulate along a combinational path. For three stages, the worst-case path delay can be estimated as tpath(max) = tpd1(max)+tpd2(max)+tpd3(max). Use maximum datasheet values for the relevant supply voltage, capacitive load, and temperature conditions. TI specifies a maximum propagation delay of 3.8 ns at 3.3 V for the SN74LVC1G00 under its stated test conditions. [5] |
| Rise and fall time | Describes how long the signal takes to transition between defined LOW and HIGH voltage points. Datasheets may specify output transition time and allowable input transition rate. | Slow edges can increase timing uncertainty and may increase current consumption or cause unreliable behavior in some CMOS devices. Output edge rate also depends on supply voltage and load capacitance. |
| Quiescent supply current ICC | The current drawn from the supply while the device is powered but not actively switching, under specified conditions. | Quiescent current affects standby power, especially in battery-powered or always-on systems. Logic families that perform the same function can have substantially different static-current requirements. [1] |
| Switching power | Power used when internal and external capacitances charge and discharge during logic transitions. A common first-order CMOS estimate is Pdynamic = αCeffVCC2f [3] where Cef is the effective switched capacitance,α is the switching-activity factor, and f is switching frequency. | Dynamic power increases with switching activity, effective capacitance, supply voltage squared, and frequency. More accurate estimates may require datasheet power-dissipation capacitance, load information, application data, or direct measurement. |
| Operating temperature | Defines the temperature range over which the manufacturer guarantees specified device operation. | Temperature can affect propagation delay, leakage current, output drive, and other electrical characteristics. Designs for industrial, automotive, or harsh environments must use a device grade and datasheet limits that cover the expected temperature range. |
CMOS logic families differ in supply-voltage range, input thresholds, switching performance, power characteristics, and intended use. TI’s Logic Guide SDYU001AC, Rev. AC, November 2025, provides family-level comparisons for HC, HCT, AHC, AHCT, LVC, AUP, and AUC. [1]
| Family | TI Family Supply Range | Input Standard | TI Family Speed Class | Typical Design Use |
| HC | 2–6 V | Standard CMOS | 20+ MHz | General-purpose 3.3 V and 5 V logic |
| HCT | 4.5–5.5 V | TTL-compatible CMOS | 20+ MHz | 5 V systems that must accept TTL-level inputs |
| AHC | 2–5.5 V | Standard CMOS | 100+ MHz | Faster general-purpose CMOS logic |
| AHCT | 4.5–5.5 V | TTL-compatible CMOS | 100+ MHz | Faster 5 V logic with TTL-compatible inputs |
| LVC | 1.65–3.6 V; LVCxG extends to 5.5 V | Standard CMOS | 100+ MHz | Low-voltage systems needing fast switching and strong drive options |
| AUP | 0.8–3.6 V | Standard CMOS | 180+ MHz | Low-power and battery-operated systems |
| AUC | 1.65–2.7 V | Standard CMOS | 250+ MHz | High-speed, low-voltage logic |
The TI Family Speed Class values are broad family comparisons, not guaranteed maximum operating frequencies for every device. Actual timing depends on the specific part, supply voltage, load, temperature, and datasheet test conditions. Input compatibility is also important. HCT and AHCT use TTL-compatible input thresholds at 5 V, while HC, AHC, LVC, AUP, and AUC use CMOS-level input requirements appropriate to their operating ranges. For LVC, the standard family is specified at 1.65–3.6 V, while LVCxG devices extend operation to 5.5 V. [1]
A 3.3 V microcontroller output is not automatically compatible with every 5 V logic input. Compatibility depends on the MCU’s guaranteed output levels and the receiver’s specified input thresholds, not simply on the nominal supply voltages.
TI’s 5 V logic switching-standard comparison provides representative input thresholds for standard CMOS and TTL-compatible CMOS. These are representative switching standards rather than universal limits for every IC. Always check the selected device’s datasheet. [1]

Figure 3. 3.3 V MCU Interface to Standard and TTL-Compatible 5 V Logic
For a standard 5 V CMOS input, a nominal 3.3 V MCU output may fall below the required HIGH threshold. Therefore, the connection is not guaranteed simply because the MCU output is described as 3.3 V. The HIGH-level compatibility requirement is: [1]
VOH(min, MCU) ≥ VIH(min, receiver)
TTL-compatible CMOS families such as HCT use lower input thresholds. For example, the SN74HCT00 specifies TTL-compatible input thresholds over its recommended 4.5–5.5 V supply range. A 3.3 V MCU can therefore often drive this type of input, provided the MCU’s guaranteed output levels meet the receiver requirements. [6]
Both HIGH and LOW states must be verified:
VOH(min, MCU) ≥ VIH(min, receiver)
and
VOL(max, MCU) ≥ VIL(max, receiver)
In Figure 3, the MCU output is labeled:
3.3V nominal output; verify VOH at the required load.
The connection is valid only when both equations are satisfied.
This example shows why nominal supply voltage alone does not determine logic compatibility. The source’s guaranteed HIGH and LOW output levels must be compared with the receiver’s specified input thresholds.
| Factor | Discrete Logic Gates | MCU | CPLD | FPGA |
| Implementation method | Physical logic ICs such as AND, OR, NOT, NAND, and NOR gates | Firmware executed by a processor and its peripherals | Programmable hardware logic | Programmable hardware with configurable logic, routing, memory, DSP, and other resources depending on the device |
| Parallel operation | Gates operate concurrently | Software execution is generally sequential, although peripherals, interrupts, DMA, and multiple cores can operate concurrently | Hardware functions can operate concurrently | Many hardware functions can operate concurrently |
| Timing behavior | Determined by gate, loading, and interconnect delays | Depends on clocking, instruction execution, interrupts, peripherals, and software architecture | Hardware-timed; predictable when the design is correctly constrained and meets timing | Hardware-timed; predictable when the design is correctly constrained and meets timing |
| Logic capacity | Practical for relatively small functions before component count and routing become inconvenient | Handles complex control and computation in software within processor and peripheral limits | Suitable for control, decoding, sequencing, and other logic within available device resources | Supports larger logic designs, memories, arithmetic blocks, high-speed interfaces, and other device-specific resources |
| Changes after design | Usually requires a hardware change | Firmware can generally be updated | Logic configuration can be updated if supported by the device and system | Logic configuration can be updated if supported by the device and system |
| Power consideration | Depends on gate family, device count, switching activity, load, and frequency | Depends on processor family, operating mode, peripherals, voltage, and workload | Depends on device family, utilized resources, clock activity, I/O standards, and operating frequency | Depends on device family, utilized resources, clock activity, I/O standards, and operating frequency |
| Development needs | Schematic design, logic-family selection, and electrical verification | Firmware development and peripheral configuration | HDL or supported schematic design, synthesis, constraints, and timing verification | HDL or other supported design entry, synthesis, implementation, timing constraints, and static timing analysis |
Likewise, no platform is universally faster, lower power, or simpler. The appropriate choice depends on the required logic complexity, latency, parallelism, power target, update requirements, available development tools, cost, and device resources.
Technical References
[1] Texas Instruments. Logic Guide, Rev. AC, SDYU001AC, revised November 2025.
[2] Nolan, S. M., Soltero, J. M., and Rao, S. Understanding and Interpreting Standard-Logic Data Sheets, Rev. C, Texas Instruments, SZZA036C, revised December 2015.
[3] Texas Instruments. CMOS Power Consumption and Cpd Calculation, Rev. B, SCAA035B, June 1997.
[4] Texas Instruments. Implications of Slow or Floating CMOS Inputs, Rev. E, SCBA004E, revised July 2021.
[5] Texas Instruments. SN74LVC1G00 Single 2-Input Positive-NAND Gate Datasheet, Rev. AC, August 2026.
[6] Texas Instruments. SNx4HCT00 Quadruple 2-Input Positive-NAND Gates Datasheet, Rev. F, revised October 2022.
[7] International Organization for Standardization. ISO 13849-1:2023, Safety of Machinery - Safety-Related Parts of Control Systems - Part 1: General Principles for Design, 4th ed., April 2023.