Motor drivers are used in controlling the speed, direction, and power of electric motors in modern electronic systems. As motor-driven devices become more powerful and efficient, reliable driver ICs are required to handle high current loads while maintaining safe and stable operation. The BTS7960B motor driver IC is designed to meet these needs. This article will discuss the BTS7960B motor driver IC overview, technical specifications, circuit operation, etc.

The BTS7960B Motor Driver IC is a fully integrated high-current half-bridge driver designed to control heavy loads with efficient power switching. It belongs to the NovalithIC™ family and combines power MOSFETs and a driver circuit in one compact package. Inside the device are a p-channel high-side MOSFET and an n-channel low-side MOSFET, allowing the IC to manage current flow with low on-state resistance and stable operation.
The integrated driver simplifies control by providing logic-level inputs, making it easy to interface with microcontrollers. Since the high-side switch uses a p-channel MOSFET, the design does not require a charge pump, which helps reduce electromagnetic interference and simplifies the circuit design.
The BTS7960B also includes several protection and monitoring functions such as current sensing, over-temperature protection, over-current protection, undervoltage protection, and short-circuit protection. It also supports slew rate adjustment and dead-time generation, helping improve switching performance and system reliability.


| Pin Number | Pin Name | Description |
| 1 | IN | Logic input used to control the switching state of the MOSFETs. |
| 2 | INH | Inhibit input used to enable or disable the driver IC. |
| 3 | SR | Slew rate adjustment pin used to control switching speed and reduce EMI. |
| 4 | GND | Ground connection for the device and control circuitry. |
| 5 | IS | Current sense output that provides a signal proportional to the load current. |
| 6 | VS | Power supply input for the driver and MOSFET stage. |
| 7 | OUT | Output pin connected to the motor or load. |
| 8 | TAB | Metal tab connected internally to the power stage for heat dissipation and electrical connection. |
• BTN7960
• BTN7971B
• BTN8982TA
• IFX007T
• VNH2SP30
• VNH5019
• L298N
• MC33926
• DRV8871
• DRV8412
How the IC integrates control logic, gate driver circuits, and power MOSFET switches in one package? The device is divided into three main sections: the Top-Chip control circuit, the high-side base chip, and the low-side base chip. These blocks work together to control the current flow through the output stage.

The Top-Chip contains the internal driver and protection circuits. It receives the input control signals such as IN, INH, SR, and IS. This block manages the gate driver, generates dead time, adjusts the slew rate, and monitors system safety through undervoltage, overvoltage, overtemperature, and overcurrent protection. It also includes current sensing and diagnostic functions to monitor the load.
The high-side base chip (HS) and low-side base chip (LS) contain the integrated power MOSFETs that form the half-bridge structure. The high-side switch connects the load to the VS supply, while the low-side switch connects the load to ground (GND). The output pin (OUT) is located between these two switches and delivers the controlled current to the load.
| Parameter | Specification |
| Mounting Type | Surface Mount |
| Package / Case | TO-263-8, D2Pak (7 Leads + Tab), TO-263CA |
| Number of Pins | 7 |
| Series | NovalithIC™ |
| Part Status | Obsolete |
| Operating Temperature | −40°C to 150°C (TJ) |
| Supply Voltage | 5.5 V – 27.5 V |
| Voltage – Load | 5.5 V – 27.5 V |
| Supply Voltage (Typical) | 8 V |
| Output Configuration | Half Bridge |
| Output Current per Channel | 40 A |
| Max Output Current | 60 A |
| Output Peak Current Limit (Nominal) | 62 A |
| RDS(on) (Typical) | 9 mΩ (LS), 7 mΩ (HS) |
| Quiescent Current | 7 µA |
| Turn-On Time | 25.4 µs |
| Turn-Off Time | 16 µs |
| Fault Protection | Current Limiting, Over Temperature, Short Circuit, UVLO |
| Built-in Protections | Transient, Over Current, Over Voltage, Thermal, Under Voltage |
| Interface | Logic |
| Load Type | Inductive |
| Packaging | Tape & Reel (TR) |
| Moisture Sensitivity Level | MSL 1 (Unlimited) |
| Terminal Form | Gull Wing |
| Terminal Position | Dual |
| Number of Terminations | 7 |
| Dimensions | Length: 9.9 mm, Width: 9.2 mm |
| Halogen Free | No |
| RoHS Status | Non-RoHS Compliant |
The BTS7960B supports a high peak current capability of at least 33 A, allowing it to drive high-power loads while maintaining stable operation.
It features a typical path resistance of about 16 mΩ at 25°C, which helps reduce power loss and improves overall efficiency.
The device has a very low quiescent current of approximately 7 µA at 25°C, making it suitable for energy-efficient systems.
The driver supports PWM operation up to 25 kHz with active freewheeling, enabling smooth and precise control of load current.
A switched-mode current limiting feature helps reduce power dissipation during overcurrent conditions.
The IC includes a status flag diagnosis and current sensing capability, allowing monitoring of load current and system status.
The BTS7960B provides overtemperature shutdown with latch behavior, overvoltage protection, and undervoltage shutdown for safe operation.
The integrated driver circuit supports logic-level inputs, making it easy to interface with microcontrollers.
The device offers adjustable slew rates, which help optimize switching performance and reduce electromagnetic interference (EMI).

The circuit diagram shows how two BTS7960B half-bridge drivers are combined to form a high-current H-bridge motor control system. Each BTS7960B controls one side of the motor by switching the high-side and low-side MOSFETs. When the two drivers operate together, they allow the motor current to flow in either direction, enabling forward and reverse rotation.
A microcontroller (XC866) sends control signals to the BTS7960B drivers through logic inputs such as IN and INH. These signals determine which internal MOSFET switches turn on or off. By applying PWM signals, the microcontroller can control the speed of the motor while the driver manages the high current required by the load.
The circuit also includes a voltage regulator (TLE4278G) that provides a stable supply voltage for the control electronics. A reverse polarity protection circuit is placed at the power input to protect the system from incorrect power connections. Together, these components ensure safe operation, reliable motor control, and protection for the driver and control circuitry.
• High-current DC motor control
• Robotics motor drive systems
• Electric scooter motor control
• Automated industrial machinery
• Motorized actuators and positioning systems
• Automotive motor control systems
• Conveyor belt motor drivers
• Smart home motorized devices
• Electric tools and equipment
• DIY motor control projects with microcontrollers
| Feature | BTS7960B | BTN7960 | VNH2SP30 | L298N |
| Driver Type | Half Bridge | Half Bridge | Full Bridge | Dual H-Bridge |
| Operating Voltage | 5.5 – 27 V | 5.5 – 27 V | 5.5 – 16 V | 5 – 46 V |
| Continuous Current | ~40 A | ~43 A | ~30 A | ~2 A |
| Peak Current | ~60 A | ~55 A | ~41 A | ~3 A |
| PWM Frequency | Up to 25 kHz | Up to 25 kHz | Up to 20 kHz | Up to ~25 kHz |
| Technology | Integrated MOSFET | Integrated MOSFET | Integrated MOSFET | Bipolar Transistor |
| Protection Features | Overcurrent, thermal, undervoltage | Overcurrent, thermal | Thermal, overcurrent | Limited protection |
| Efficiency | High (low RDS(on)) | High | High | Lower efficiency |

Infineon Technologies AG company uses advanced semiconductor fabrication processes and power MOSFET technologies to produce reliable high-current drivers. The BTS7960B is built using vertical MOSFET technology, which enables low on-state resistance and efficient current handling. Infineon integrates a p-channel high-side MOSFET, an n-channel low-side MOSFET, and a driver control circuit into a single package through multi-chip integration techniques. These chips are assembled on a common leadframe using advanced packaging methods to improve thermal performance and electrical reliability.