The XENSIV DPS368 is a high-performance digital barometric pressure sensor designed to meet the growing demand for accurate sensing in space-constrained and harsh environments. This article will discuss the DPS368 overview, pinout, functional block diagram, technical specifications, features, application circuits, comparisons, and more.

The XENSIV DPS368 is an ultra-small digital barometric pressure sensor developed by Infineon Technologies for accurate pressure and temperature measurement in compact and demanding environments. It features a waterproof and dust-resistant package, making it suitable for applications exposed to moisture, humidity, or harsh conditions.
This sensor operates over a pressure range of 300 hPa to 1200 hPa and delivers high-resolution 24-bit digital output. With excellent relative accuracy, it enables precise altitude detection, airflow monitoring, and environmental sensing. The DPS368 supports both I²C and SPI interfaces, allowing easy integration with common microcontrollers.
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| Pin No. | Pin Name | Description |
| 1 | GND | Ground reference for the sensor. Must be connected to system ground. |
| 2 | CSB | Chip Select for SPI communication. It is active-low in SPI mode. In I²C mode, this pin is not required and can be left floating or tied to VDDIO. |
| 3 | SDI | Serial data line. Acts as bidirectional data (SDA) in I²C, data input/output in SPI 3-wire, and data input in SPI 4-wire. |
| 4 | SCK | Clock input pin. Used as the serial clock for both SPI and I²C communication. |
| 5 | SDO | Serial data output in SPI 4-wire mode. In SPI 3-wire with interrupt enabled, this pin provides the interrupt signal. In I²C mode, it defines the least significant bit of the device address and may also serve as an interrupt pin. |
| 6 | VDDIO | Digital supply voltage for the interface and internal digital logic. Sets the logic level for I/O pins. |
| 7 | GND | Additional ground pin to improve signal integrity and noise performance. |
| 8 | VDD | Main supply voltage for the analog sensing and internal circuitry. |
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The functional block diagram of the XENSIV DPS368 shows how pressure and temperature data move through the sensor from measurement to digital output. At the sensing stage, the device uses a capacitive pressure sensor to detect air pressure changes and a separate temperature sensor to monitor ambient temperature. These two signals are essential because temperature data is later used to compensate and correct pressure measurements for higher accuracy.

Both sensor signals are routed through a multiplexer (MUX), which selects whether pressure or temperature data is processed at a given time. The selected analog signal is then converted into a digital format by the ADC (Analog-to-Digital Converter). This conversion allows the sensor to work with high-resolution digital data suitable for precise calculations and low-noise performance.
After conversion, the data enters the digital signal processing stage, where factory-stored calibration coefficients are applied. This step corrects raw sensor data and ensures consistent accuracy across operating conditions. Processed results can be temporarily stored in the FIFO memory, enabling efficient data handling at higher sampling rates. Finally, the digital core sends the calibrated data through the I²C or SPI interface, while integrated voltage regulators manage power supplied via VDD and VDDIO for stable operation.
| Category | Parameter | Specification |
| Pressure Characteristics | Operating pressure range | 300 to 1200 hPa |
| Absolute pressure accuracy | ±100 Pa | |
| Relative pressure accuracy | ±6 Pa | |
| Pressure precision (RMS) | 1.0 Pa (low power), 0.35 Pa (standard), 0.2 Pa (high precision) | |
| Pressure resolution | 0.06 Pa RMS | |
| Pressure temperature sensitivity | 0.5 Pa/K | |
| Pressure measurement rate | 1 to 128 Hz | |
| Pressure measurement time | 5.2 ms (low power), 27.6 ms (standard), 105 ms (high precision) | |
| Temperature Characteristics | Operating temperature range | −40 °C to +85 °C |
| Temperature accuracy | ±0.5 °C | |
| Temperature resolution | 0.01 °C | |
| Temperature measurement rate | 1 to 128 Hz | |
| Electrical Characteristics | Analog supply voltage (VDD) | 1.7 to 3.6 V |
| Digital I/O supply (VDDIO) | 1.2 to 3.6 V | |
| Maximum voltage on any pin | 4 V | |
| Power supply rejection | 0.063 Pa RMS | |
| Current Consumption | Peak current (pressure) | 345 µA |
| Peak current (temperature) | 280 µA | |
| Standby current | 0.5 µA | |
| Current at 1 Hz sampling | 2.1 µA (low), 11 µA (standard), 38 µA (high precision) | |
| Timing Characteristics | Sensor start-up time | 12 ms |
| Calibration data ready time | 40 ms | |
| Interfaces | Digital communication | I²C and SPI |
| Maximum I²C clock | 3.4 MHz | |
| Maximum SPI clock | 10 MHz | |
| Reliability & Limits | Storage temperature | −40 °C to +125 °C |
| Maximum pressure survivability | 10,000 hPa | |
| ESD protection (HBM) | ±2 kV | |
| Long-term stability | ±1 hPa | |
| Solder drift | 0.8 hPa (minimum solder height 50 µm) |
• Environmentally resistant pressure sensor package
• Wide operating pressure range (300–1200 hPa)
• Wide operating temperature range (−40 to +85 °C)
• High pressure precision (up to ±0.002 hPa in high-precision mode)
• High relative pressure accuracy (±0.06 hPa)
• Absolute pressure accuracy (±1 hPa)
• IPx8 waterproof certification (up to 50 m water immersion for 1 hour)
• Integrated temperature sensor
• Temperature accuracy of ±0.5 °C
• Low pressure temperature sensitivity (0.5 Pa/K)
• Selectable measurement modes (low power, standard, high precision)
• Fast pressure and temperature measurement times
• Ultra-low average current consumption
• Very low standby current
• Dual power supply support (VDD and VDDIO)
• Flexible operating modes (command, background, standby)
• Factory calibration with stored compensation coefficients
• Integrated FIFO buffer (up to 32 samples)
• Interrupt support for event-driven operation
• I²C and SPI digital interfaces
• High-speed interface support (up to 3.4 MHz I²C, 10 MHz SPI)
• High measurement rate capability (up to 128 Hz)
• On-chip digital signal processing
• Integrated voltage regulators
• Excellent long-term stability
• High resistance to solder-induced drift
• Robust ESD protection (±2 kV HBM)
• Compact 8-pin PG-VLGA package (2.0 × 2.5 × 1.1 mm)
• RoHS compliant and environmentally friendly design

In the I²C configuration, the DPS368 communicates with the processor using the SDA (data) and SCK (clock) lines. Pull-up resistors are connected to VDDIO to ensure proper logic levels on the I²C bus. The CSB pin is not used for chip selection in this mode and can be left unconnected or tied to VDDIO. An optional interrupt line can be connected from the SDO pin to the processor, allowing the sensor to signal when new measurement data is available. Separate supply pins are used for analog (VDD) and digital I/O (VDDIO), each stabilized with decoupling capacitors for reliable operation.

In the SPI 4-wire setup, the DPS368 uses dedicated lines for clock (SCK), data input (SDI/MOSI), data output (SDO/MISO), and chip select (CSB). This configuration allows full-duplex communication, meaning data can be sent and received simultaneously. The CSB pin actively selects the sensor during communication, ensuring stable and fast data transfer. This mode is ideal for systems that require higher speed and clear signal separation. As with all configurations, VDD and VDDIO are powered independently and filtered using external capacitors.

In the SPI 3-wire configuration, the DPS368 reduces pin usage by combining data input and output on a single bidirectional SDI line. The processor controls the direction of this data line during communication. The SDO pin is not used in this mode, while CSB and SCK still manage device selection and timing. This setup is useful in space-constrained designs where fewer signal lines are preferred, while still maintaining SPI reliability and performance.

This configuration builds on the SPI 3-wire mode by enabling the interrupt function. The SDO pin is repurposed as an interrupt output, allowing the DPS368 to notify the processor when a measurement is complete or when FIFO data is ready. This event-driven approach reduces processor polling and lowers overall power consumption. It is especially beneficial in low-power and real-time applications where efficient data handling is critical.