Xilinx® Defense-grade 7 series FPGAs comprise three FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications. The Defense-grade 7 series FPGAs include:
Artix®-7Q Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.
Kintex®-7Q Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
Virtex®-7Q Family: Optimized for highest system performance and capacity with a 2X improvement in system performance.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, Defense-grade 7 series FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Feature
Full-range extended temperature testing
Mask set control
Fully leaded (Pb) content
Ruggedized packaging
Long-term availability
Anti-counterfeiting features
4th Generation Information Assurance and Anti-tamper support
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 11.3 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
Catalogue
FPGA / CPLD
Memory
MOS 
MCU 
DSP
OCEP
Secondary 
Other 
