 Flexible Logic Architecture 

• Three devices with 1100 to 3520 LUTs 

• Offered in WLCS, BGA and QFN packages 

 Ultra-low Power Devices 

• Advanced 40 nm ultra-low power process 

• As low as 71 µA standby current typical 

 Embedded Memory 

• Up to 80 kbits sysMEM™ Embedded Block RAM 

 Two Hardened I2 C Interfaces 

 Two Hardened SPI Interfaces 

 Two On-Chip Oscillators 

• Low Frequency Oscillator 

– 10 kHz 

• High Frequency Oscillator 

– 48 MHz 

 24 mA Current Drive RGB LED Outputs 

• Three drive outputs in each device 

• User selectable sink current up to 24 mA 

 500 mA Current Drive IR LED Output 

• One IR drive output in each device 

• User selectable sink current up to 500 mA

 On-chip DSP 

• Signed and unsigned 8-bit or 16-bit functions 

• Functions include Multiplier, Accumulator, and Multiply-Accumulate (MAC) 

 Flexible On-Chip Clocking 

• Eight low skew global signal resource, six can be directly driven from external pins 

• One PLL with dynamic interface per device 

 Flexible Device Configuration 

• SRAM is configured through: 

— Standard SPI Interface 

— Internal Nonvolatile Configuration Memory (NVCM) 

 Ultra-Small Form Factor 

• As small as 2.078 mm x 2.078 mm 

 Applications 

• Smartphones 

• Tablets and Consumer Handheld Devices 

• Handheld Commercial and Industrial Devices 

• Multi Sensor Management Applications 

• Sensor Pre-processing and Sensor Fusion 

• Always-On Sensor Applications 

• USB 3.1 Type C Cable Detect / Power Delivery Applications