The SMF30A series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. SMF30A package is 50% smaller in footprint when compare to SMA package and deliverying one of the low height profiles (1.1mm) in the industry.
Feature
200W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01%
Compatible with industrial standard package SOD-123FL
Low profile: maximum height of 1.1mm.
Low inductance, excellent clamping capability
For surface mounted applications to optimize board space
High temperature to reflow soldering guaranteed: 260°C/430sec
Typical failure mode is short from over-specified voltage or current
Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
ESD protection of data lines in accordance with IEC 61000-4-2
EFT protection of data lines in accordance with IEC 61000-4-4
Fast response time: typically less than 1.0ns from 0 Volts to VBR min
Glass passivated junction
Built-in strain relief
Plastic package is flammability rated V-0 per Underwriters Laboratories
Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
Matte tin lead–free plated
Halogen-free and RoHS compliant
Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD609A.01)
UL Recognized to UL 497B
Applications
SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications.
Catalogue
FPGA / CPLD
Memory
MOS 
MCU 
DSP
OCEP
Secondary 
Other 
