In order to meet environmental requirements, ST offers these devices in ECOPACK? packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
Feature
Silicon epitaxial planar NPN medium voltage transistor
Available in tape & reel packing
SOT-223 plastic package for surface mounting circuits
The PNP complementary type is BCP53-16
In compliance with the 2002/93/EC European Directive
Catalogue
FPGA / CPLD
Memory
MOS 
MCU 
DSP
OCEP
Secondary 
Other 
