Combining Advanced Silicon Modular Block (ASMBL™) architecture with a wide variety of flexible features, the Virtex®-4 family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. Virtex-4 FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the PowerPC® processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The basic Virtex-4 FPGA building blocks are enhancements of thouse found in the popular Virtex, Virtex-E, Virtex-II, Virtex-II Pro, and Virtex-II Pro X product families, so previous-generation designs are upward compatible. Virtex-4 devices are produced on a state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.
Three Families — LX/SX/FX
Virtex-4 LX: High-performance logic applications solution
Virtex-4 SX: High-performance solution for digital signal processing (DSP) applications
Virtex-4 FX: High-performance, full-featured solution for embedded platform applications
Xesium™ Clock Technology
Digital clock manager (DCM) blocks
Additional phase-matched clock dividers (PMCD)
Differential global clocks
XtremeDSP™ Slice
18 x 18, two’s complement, signed Multiplier
Optional pipeline stages
Built-in Accumulator (48-bit) and Adder/Subtracter
Smart RAM Memory Hierarchy
Optional pipeline stages
Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals
Distributed RAM
Dual-port 18-Kbit RAM blocks
High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.
SelectIO™ Technology
1.5V to 3.3V I/O operation
Built-in ChipSync™ source-synchronous technology
Digitally controlled impedance (DCI) active termination
Fine grained I/O banking (configuration in one bank)
Flexible Logic Resources
Secure Chip AES Bitstream Encryption
90 nm Copper CMOS Process
1.2V Core Voltage
Flip-Chip Packaging including Pb-Free Package Choices
RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]
IBM PowerPC RISC Processor Core [FX only]
PowerPC 405 (PPC405) Core
Auxiliary Processor Unit Interface (User Coprocessor)
Multiple Tri-Mode Ethernet MACs [FX only]
Number of LABs/CLBs
4656
Number of Logic Elements/Cells
41904
Total RAM Bits
2654208
Number of I/O
448
Voltage Supply
1.14V ~ 1.26V
Mounting Type
Surface Mount
Operating Temperature
0??C ~ 85??C (TJ)
Package / Case
1152-BBGA, FCBGA
Supplier Device Package
1152-FCBGA (35x35)