• General

• Integrates RF, Power Amplifiers (PAs), Clock,RF Switches, Filters, Passives, and Power Management

• Quick Hardware Design WithTI Module Collateral and Reference Designs

• Operating Temperature:–20°C to +70°C

• Small Form Factor: 13.3 × 13.4 × 2mm

• 100-Pin MOC Package

• FCC, IC, ETSI/CE, and TELEC Certified With PCB, Dipole, Chip, and PIFAAntennas

• Wi-Fi?

• WLAN Baseband Processor and RFTransceiver Support of IEEE Std 802.11b, 802.11g, and802.11n

• 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for HighThroughput: 80 Mbps (TCP), 100 Mbps (UDP)

• 2.4-GHz MRC Support for ExtendedRange

• FullyCalibrated: Production Calibration Not Required

• 4-Bit SDIO Host InterfaceSupport

• Wi-Fi Direct Concurrent Operation (Multichannel,Multirole)

• Bluetooth? and Bluetooth low energy (WL183xMOD Only)

• Bluetooth 4.2 Secure Connection Compliant and CSA2 Support (Declaration ID:D032799)

• Host Controller Interface (HCI)Transport for Bluetooth Over UART

• Dedicated Audio Processor Support of SBCEncoding + A2DP

• Dual-Mode Bluetooth and Bluetooth LowEnergy

• TI’s Bluetooth- and Bluetooth LowEnergy-Certified Stack

• Key Benefits

• Reduces DesignOverhead

• Differentiated Use Cases by Configuring WiLink? 8 Simultaneously in Two Roles (STA and AP) to Connect Directly WithOther Wi-Fi Devices on Different RF Channel (Wi-Fi Networks)

• Best-in-ClassWi-Fi With High-Performance Audio and Video Streaming Reference Applications With Up to 1.4× theRange Versus One Antenna

• Different Provisioning Methods for In-Home DevicesConnectivity to Wi-Fi in One Step

• Lowest Wi-Fi Power Consumption in ConnectedIdle (< 800 μA)

• Configurable Wake on WLAN Filters to Only Wake Up theSystem

• Wi-Fi-Bluetooth Single AntennaCoexistence

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