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The CL31B475KBHNFNE is CAP CER 4.7UF 50V X7R 1206, that includes CL Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 1206 (3216 Metric), that offers Capacitance features such as 4.7μF, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Surface Mount, MLCC Mounting Type, the device can also be used as 50V Voltage Rated. In addition, the Size Dimension is 0.126" L x 0.063" W (3.20mm x 1.60mm), the device is offered in General Purpose Applications, the device has a ±10% of Tolerance, and Temperature Coefficient is X7R, and the Thickness Max is 0.071" (1.80mm).

CL31B475KBHNNFE with user guide, that includes 50V Voltage Rated, they are designed to operate with a ±10% Tolerance, Thickness Max is shown on datasheet note for use in a 0.071" (1.80mm), that offers Temperature Coefficient features such as X7R, Size Dimension is designed to work in 0.126" L x 0.063" W (3.20mm x 1.60mm), as well as the CL Series, the device can also be used as Digi-ReelR Alternate Packaging Packaging. In addition, the Package Case is 1206 (3216 Metric), it has an Operating Temperature range of -55°C ~ 125°C, the device has a Surface Mount, MLCC of Mounting Type, and Capacitance is 4.7μF, and the Applications is General Purpose.

CL31B475KANE with circuit diagram manufactured by SAMSUNG. is part of the IC Chips.