The AD5560JSVUZ is a high performance, highly integrated device power supply consisting of programmable force voltages and measure ranges. This part includes the required DAC levels to set the programmable inputs for the drive amplifier, as well as clamping and comparator circuitry. Offset and gain correction is included on-chip for DAC functions. A number of programmable measure current ranges are available: five internal fixed ranges and two external customer-selectable ranges (EXTFORCE1 and EXTFORCE2) that can supply currents up to ±1.2 A and ±500 mA, respectively. The voltage range possible at this high current level is limited by headroom and the maximum power dissipation. Current ranges in excess of ±1.2 A or at high current and high voltage combinations can be achieved by paralleling or ganging multiple DPS devices. Open-drain alarm outputs are provided in the event of overcurrent, overtemperature, or Kelvin alarm on either the SENSE or DUTGND line.
The DPS functions are controlled via a simple 3-wire serial interface compatible with SPI, QSPI™, MICROWIRE™, and DSP interface standards running at clock speeds of up to 50 MHz.
Feature
Programmable device power supply (DPS)
5 internal current ranges (on-chip RSENSE)
±5 μA, ±25 μA, ±250 μA, ±2.5 mA, ±25 mA
2 external high current ranges (external RSENSE)
Integrated programmable levels
All 16-bit DACs: force DAC, comparator DACs, clamp DACs, offset DAC, OSD DAC, DGS DAC
Programmable Kelvin clamp and alarm
Offset and gain correction registers on-chip
Ramp mode on force DAC for power supply slewing
Programmable slew rate feature, 1 V/μs to 0.3 V/μs
DUTGND Kelvin sense and alarm
25 V FV span with asymmetrical operation within −22 V/+25 V
On-chip comparators
Gangable for higher current
Guard amplifier
System PMU connections
Current clamps
Die temperature sensor and shutdown feature
On-chip diode thermal array
Diagnostic register allows access to internal nodes
Open-drain alarm flags (temperature, current clamp, Kelvin alarm)
SPI-/MICROWIRE-/DSP-compatible interface
64-lead (10 mm × 10 mm) TQFP with exposed pad (on top)
72-ball (8 mm × 8 mm) flip-chip BGA
Applications
Catalogue
FPGA / CPLD
Memory
MOS 
MCU 
DSP
OCEP
Secondary 
Other 
