The MPU-6050™ parts are the world’s first MotionTracking devices designed for the low power, low cost, and high-performance requirements of smartphones, tablets and wearable sensors.The MPU-6050 incorporates InvenSense’s MotionFusion™ and run-time calibration firmware that enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices in motion-enabled products, guaranteeing that sensor fusion algorithms and calibration procedures deliver optimal performance for consumers.The MPU-6050 devices combine a 3-axis gyroscope and a 3-axis accelerometer on the same silicon die, together with an onboard Digital Motion Processor™ (DMP™), which processes complex 6-axis MotionFusion algorithms. The device can access external magnetometers or other sensors through an auxiliary master I²C bus, allowing the devices to gather a full set of sensor data without intervention from the system processor. The devices are offered in a 4 mm x 4 mm x 0.9 mm QFN package.The InvenSense MotionApps™ Platform that comes with the MPU-6050 abstracts motion-based complexities, offloads sensor management from the operating system, and provides a structured set of APIs for application development.For precision tracking of both fast and slow motions, the parts feature a user-programmable gyro full-scale range of ±250, ±500, ±1000, and ±2000 °/sec (dps), and a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. Additional features include an embedded temperature sensor and an on-chip oscillator with ±1% variation over the operating temperature range. Freesky is an authorized InvenSense distributor.
Feature
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
Digital-output temperature sensor
9-Axis MotionFusion by the on-chip digital motion processor (DMP)
Auxiliary master I2C bus for reading data from external sensors
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
MEMS structure hermetically sealed and bonded at wafer level
10,000 g shock tolerant
400kHz fast mode I2C for communicating with all registers