• 200W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01%

• Compatible with industrial standard package SOD-123FL

• Low profile: maximum height of 1.1mm.

• Low inductance, excellent clamping capability

• For surface mounted applications to optimize board space

• High temperature to reflow soldering guaranteed: 260°C/430sec

• Typical failure mode is short from over-specified voltage or current

• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

• IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)

• ESD protection of data lines in accordance with IEC 61000-4-2

• EFT protection of data lines in accordance with IEC 61000-4-4

• Fast response time: typically less than 1.0ns from 0 Volts to VBR min

• Glass passivated junction

• Built-in strain relief

• Plastic package is flammability rated V-0 per Underwriters Laboratories

• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C

• Matte tin lead–free plated

• Halogen-free and RoHS compliant

• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD609A.01)

• UL Recognized to UL 497B

SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications.