The TI AM437x high-performance processors are based on the ARM Cortex-A9 core.
The processors are enhanced with 3D graphics acceleration for richgraphical user interfaces, as well as a coprocessor for deterministic, real-time processingincluding industrial communication protocols, such as EtherCAT, PROFIBUS, EnDat, and others. Thedevices support high-level operating systems (HLOS).Linux is available free of chargefrom TI. Other HLOSs are available from TI’s Design Network and ecosystem partners.
These devices offer an upgrade to systems based on lower performanceARM cores and provide updated peripherals, including memory options such as QSPI-NOR andLPDDR2.
The processors contain the subsystems shown in the Functional Block Diagram, and a brief description of eachfollows.
The processor subsystem is based on the ARM Cortex-A9 core, and thePowerVR SGXgraphics accelerator subsystem provides 3D graphics acceleration to support display and advanceduser interfaces.
The programmable real-time unit subsystem and industrial communicationsubsystem (PRU-ICSS) is separate from the ARM core and allows independent operation and clockingfor greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces andreal-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos,EnDat, and others. The PRU-ICSS enables EnDat and another industrial communication protocol inparallel. Additionally, the programmable nature of the PRU-ICSS, along with their access to pins,events and all system-on-chip (SoC) resources, provides flexibility in implementing fast real-timeresponses, specialized data handling operations, custom peripheral interfaces, and in off-loadingtasks from the other processor cores of the SoC.
High-performance interconnects provide high-bandwidth data transfers for multipleinitiators to the internal and external memory controllers and to on-chip peripherals. The devicealso offers a comprehensive clock-management scheme.
One on-chip analog to digital converter (ADC0) can couple with thedisplay subsystem to provide an integrated touch-screen solution. The other ADC (ADC1) can combinewith the pulse width module to create a closed-loop motor control solution.
The RTC provides a clock reference on a separate power domain. The clock referenceenables a battery-backed clock reference.
The camera interface offers configuration for a single- or dual-cameraparallel port.
Cryptographic acceleration is available in all devices. All othersupported security features, including support for Secure boot, debug security and support forTrusted execution environment is available on HS (High-Security) devices. For more informationabout HS devices, contact your TI sales representative.
Highlights
Crypto Hardware Accelerators (AES, SHA, RNG, DES, and 3DES)
Secure Boot (Avaliable Only on AM437x High-Security [AM437xHS] Devices)
Two Controller Area Network (CAN) Ports
Six UARTs, Two McASPs, Five McSPIs, Three I2C Ports, One QSPI, and One HDQ or 1-Wire
NEON SIMD Coprocessor and Vector Floating Point (VFPv3) Coprocessor
32KB of Both L1 Instruction and Data Cache
256KB of L2 Cache or L3 RAM
Sitara ARM Cortex-A9 32-Bit RISC Processor With Processing Speed up to 1000 MHz
32-Bit LPDDR2, DDR3, and DDR3L Support
General-Purpose Memory Support (NAND, NOR, SRAM) Supporting up to 16-Bit ECC
SGX530 Graphics Engine
Display Subsystem
Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
Real-Time Clock (RTC)
Up to Two USB 2.0 High-Speed Dual-Role (Host or Device) Ports With Integrated PHY
10, 100, and 1000 Ethernet Switch Supporting up to Two Ports
Serial Interfaces:
Security
Two 12-Bit Successive Approximation Register (SAR) ADCs
Up to Three 32-Bit Enhanced Capture (eCAP) Modules
Up to Three Enhanced Quadrature Encoder Pulse (eQEP) Modules
Up to Six Enhanced High-Resolution PWM (eHRPWM) Modules
MPU Subsystem
JTAG
Embedded Trace Buffer
ARM Cortex-A9 32-Bit RISC Microprocessor With Processing Speed up to 1000 MHz
32KB of Both L1 Instruction and Data Cache
256KB of L2 Cache (Option to Configure as L3 RAM)
256KB of On-Chip Boot ROM
64KB of On-Chip RAM
Secure Control Module (SCM) (Avaliable Only on AM437xHS Devices)
Emulation and Debug
Interrupt Controller
On-Chip Memory (Shared L3 RAM)
256KB of General-Purpose On-Chip Memory Controller (OCMC) RAM
Accessible to All Masters
Supports Retention for Fast Wakeup
Up to 512KB of Total Internal RAM
(256KB of ARM Memory Configured as L3 RAM + 256KB of OCMC RAM)
External Memory Interfaces (EMIFs)
LPDDR2: 266-MHz Clock (LPDDR2-533 Data Rate)
DDR3 and DDR3L: 400-MHz Clock (DDR-800 Data Rate)
32-Bit Data Bus
2GB of Total Addressable Space
Supports One x32, Two x16, or Four x8 Memory Device Configurations
DDR Controllers:
General-Purpose Memory Controller (GPMC)
Flexible 8- and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, and SRAM)
Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
Uses Hamming Code to Support 1-Bit ECC
Error Locator Module (ELM)
Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
One UART Port With Flow Control Pins, Supports up to 12 Mbps
One eCAP Module
Two MII Ethernet Ports that Support Industrial Ethernet, such as EtherCAT
One MDIO Port
Each Core is a 32-Bit Load and Store RISC Processor Capable of Running at 200 MHz
12KB (PRU-ICSS1), 4KB (PRU-ICSS0) of Instruction RAM With Single-Error Detection (Parity)
8KB (PRU-ICSS1), 4KB (PRU-ICSS0) of Data RAM With Single-Error Detection (Parity)
Single-Cycle 32-Bit Multiplier With 64-Bit Accumulator
Enhanced GPIO Module Provides Shift-In and Shift-Out Support and Parallel Latch on External Signal
Supports Protocols such as EtherCAT, PROFIBUS, PROFINET, and EtherNet/IP, EnDat 2.2, and More
Two Programmable Real-Time Units (PRUs) Subsystems With Two PRU Cores Each
12KB (PRU-ICSS1 Only) of Shared RAM With Single-Error Detection (Parity)
Three 120-Byte Register Banks Accessible by Each PRU
Interrupt Controller Module (INTC) for Handling System Input Events
Local Interconnect Bus for Connecting Internal and External Masters to the Resources Inside the PRU-ICSS
Peripherals Inside the PRU-ICSS
Industrial Communication is Supported by Two PRU-ICSS Subsystems
Power, Reset, and Clock Management (PRCM) Module
Two Nonswitchable Power Domains (RTC and Wake-Up Logic [WAKE-UP])
Three Switchable Power Domains (MPU Subsystem, SGX530 [GFX], Peripherals and Infrastructure [PER])
Dynamic Voltage Frequency Scaling (DVFS)
Integrated High-Frequency Oscillator Used to Generate a Reference Clock (19.2, 24, 25, and 26 MHz) for Various System and Peripheral Clocks
Supports Individual Clock Enable and Disable Control for Subsystems and Peripherals to Facilitate Reduced Power Consumption
Five ADPLLs to Generate System Clocks (MPU Subsystem, DDR Interface, USB, and Peripherals [MMC and SD, UART, SPI, I2C], L3, L4, Ethernet, GFX [SGX530], and LCD Pixel Clock)
Controls the Entry and Exit of Deep-Sleep Modes
Responsible for Sleep Sequencing, Power Domain Switch-Off Sequencing, Wake-Up Sequencing, and Power Domain Switch-On Sequencing
Clocks
Power
Real-Time Clock (RTC)
Real-Time Date (Day, Month, Year, and Day of Week) and Time (Hours, Minutes, and Seconds) Information
Internal 32.768-kHz Oscillator, RTC Logic, and 1.1-V Internal LDO
Independent Power-On-Reset (RTC_PWRONRSTn) Input
Dedicated Input Pin (RTC_WAKEUP) for External Wake Events
Programmable Alarm Can Generate Internal Interrupts to the PRCM for Wakeup or Cortex-A9 for Event Notification
Programmable Alarm Can Be Used With External Output (RTC_PMIC_EN) to Enable the Power-Management IC to Restore Non-RTC Power Domains
Peripherals
Dedicated 16-Bit Time-Base Counter With Time and Frequency Controls
Configurable as Six Single-Ended, Six Dual-Edge Symmetric, or Three Dual-Edge Asymmetric Outputs
Configurable as Three Capture Inputs or Three Auxiliary PWM Outputs
867K Samples Per Second
Input Can Be Selected from Any of the Eight Analog Inputs Multiplexed Through an 8:1 Analog Switch
ADC0 Can Be Configured to Operate as a 4, 5-, or 8-Wire Resistive Touch Screen Controller (TSC)
Display Modes
Display Support
Signal Processing
Programmable Pixel Memory Formats (Palletized: 1-, 2-, 4-, and 8-Bits Per Pixel; RGB 16- and 24-Bits Per Pixel; and YUV 4:2:2)
256- × 24-Bit Entries Palette in RGB
Up to 2048 × 2048 Resolution
Four Types of Displays Are Supported: Passive and Active Colors; Passive and Active Monochromes
4- and 8-Bit Monochrome Passive Panel Interface Support (15 Grayscale Levels Supported Using Dithering Block)
RGB 8-Bit Color Passive Panel Interface Support (3,375 Colors Supported for Color Panel Using Dithering Block)
RGB 12-, 16-, 18-, and 24-Bit Active Panel Interface Support (Replicated or Dithered Encoded Pixel Values)
Remote Frame Buffer (Embedded in the LCD Panel) Support Through the RFBI Module
Partial Refresh of the Remote Frame Buffer Through the RFBI Module
Partial Display
Multiple Cycles Output Format on 8-, 9-, 12-, and 16-Bit Interface (TDM)
Overlay and Windowing Support for One Graphics Layer (RGB or CLUT) and Two Video Layers (YUV 4:2:2, RGB16, and RGB24)
RGB 24-Bit Support on the Display Interface, Optionally Dithered to RGB 18Bit Pixel Output Plus 6-Bit Frame Rate Control (Spatial and Temporal)
Transparency Color Key (Source and Destination)
Synchronized Buffer Update
Gamma Curve Support
Multiple-Buffer Support
Cropping Support
Color Phase Rotation
Tile-Based Architecture Delivering up to 20M Poly/sec
Universal Scalable Shader Engine is a Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality
Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0, and OGL2.0
Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0
Fine-Grained Task Switching, Load Balancing, and Power Management
Advanced Geometry DMA-Driven Operation for Minimum CPU Interaction
Programmable High-Quality Image Anti-Aliasing
Fully Virtualized Memory Addressing for OS Operation in a Unified Memory Architecture
DMTIMER1 is a 1-ms Timer Used for Operating System (OS) Ticks
DMTIMER4–DMTIMER7 are Pinned Out
32 GPIOs per Bank (Multiplexed With Other Functional Pins)
GPIOs Can be Used as Interrupt Inputs (up to Two Interrupt Inputs per Bank)
Standard Mode (up to 100 kHz)
Fast Mode (up to 400 kHz)
1-, 4-, and 8-Bit MMC, SD, and SDIO Modes
1.8- or 3.3-V Operation on All Ports
Up to 48-MHz Clock
Supports Card Detect and Write Protect
Complies With MMC4.3 and SD and SDIO 2.0 Specifications
Supports eXecute In Place (XIP) from Serial NOR FLASH
McSPI0–McSPI2 Support up to Four Chip Selects
McSPI3 and McSPI4 Support up to Two Chip Selects
Up to 48 MHz
All UARTs Support IrDA and CIR Modes
All UARTs Support RTS and CTS Flow Control
UART1 Supports Full Modem Control
Transmit and Receive Clocks up to 50 MHz
Up to Four Serial Data Pins Per McASP Port With Independent TX and RX Clocks
Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
FIFO Buffers for Transmit and Receive (256 Bytes)
Supports CAN Version 2 Parts A and B
Integrated Switch
Each MAC Supports MII, RMII, and RGMII and MDIO Interfaces
Ethernet MACs and Switch Can Operate Independent of Other Functions
IEEE 1588v2 Precision Time Protocol (PTP)
Up to Two USB 2.0 High-Speed Dual-Role (Host or Device) Ports With Integrated PHY
Up to Two Industrial Gigabit Ethernet MACs
(10, 100, and 1000 Mbps)
Up to Two CAN Ports
Up to Two Multichannel Audio Serial Ports (McASPs)
Up to Six UARTs
Up to Five Master and Slave McSPIs
One Quad-SPI
One Dallas 1-Wire and HDQ Serial Interface
Up to Three MMC, SD, and SDIO Ports
Up to Three I2C Master and Slave Interfaces
Up to Six Banks of General-Purpose I/O (GPIO)
Up to Three External DMA Event Inputs That Can Also be Used as Interrupt Inputs
Twelve 32-Bit General-Purpose Timers
One Public Watchdog Timer
One Free-Running, High-Resolution 32-kHz Counter (synctimer32K)
One Secure Watchdog Timer (Avaliable Only on AM437xHS Devices)
SGX530 3D Graphics Engine
Display Subsystem
Two 12-Bit SAR ADCs (ADC0, ADC1)
Up to Three 32-Bit eCAP Modules
Up to Six Enhanced eHRPWM Modules
Up to Three 32-Bit eQEP Modules
Device Identification
Production ID
Device Part Number (Unique JTAG ID)
Device Revision (Readable by Host ARM)
Security Keys (Avaliable Only on AM437xHS Devices)
Feature Identification
Factory Programmable Electrical Fuse Farm (FuseFarm)
Debug Interface Support
JTAG and cJTAG for ARM (Cortex-A9 and PRCM) and PRU-ICSS Debug
Supports Real-Time Trace Pins (for Cortex-A9)
64-KB Embedded Trace Buffer (ETB)
Supports Device Boundary Scan
Supports IEEE 1500
DMA
Transfers to and from On-Chip Memories
Transfers to and from External Storage (EMIF, GPMC, and Slave Peripherals)
On-Chip Enhanced DMA Controller (EDMA) Has Three Third-Party Transfer Controllers (TPTCs) and One Third-Party Channel Controller (TPCC), Which Supports up to 64 Programmable Logical Channels and Eight QDMA Channels
EDMA is Used for:
InterProcessor Communication (IPC)
Integrates Hardware-Based Mailbox for IPC and Spinlock for Process Synchronization Between the Cortex-A9, PRCM, and PRU-ICSS
Boot Modes
Boot Mode is Selected Through Boot Configuration Pins Latched on the Rising Edge of the PWRONRSTn Reset Input Pin
Camera
Dual Port 8- and 10-Bit BT656 Interface
Dual Port 8- and 10-Bit Including External Syncs
Single Port 12-Bit
YUV422/RGB422 and BT656 Input Format
RAW Format
Pixel Clock Rate up to 75 MHz
Package
491-Pin BGA Package (17-mm × 17-mm) (ZDN Suffix), 0.65-mm Ball Pitch With Via Channel Array Technology to Enable Low-Cost Routing
Number of UARTs
6
Product Lifecycle Status
Active
Packaging
Tray
Case/Package
BGA-491
RoHS
Compliant
Lead Free Status
Lead Free
ECCN Code
5A992.c