The DFE18SAN1R0MG0L parts are POWER INDUCTORS - SMD 1.0 UH 1.0.7A, manufactured by MURATA are available for purchase at Jotrin Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The DFE18SAN1R0MG0L components of Jotrin Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.

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The DFE10I600PM is DIODE GEN PURP 600V 10A TO220FP, that includes DFE10I600PM Series, they are designed to operate with a Fast Recovery Rectifiers Product, Packaging is shown on datasheet note for use in a Tube, that offers Unit Weight features such as 0.081130 oz, Mounting Style is designed to work in Through Hole, it has an Operating Temperature Range range of - 55 C to + 150 C, the device can also be used as TO-220-2 Full Pack, Isolated Tab Package Case. In addition, the Mounting Type is Through Hole, the device is offered in TO-220ACFP Supplier Device Package, the device has a Single of Configuration, and Speed is Fast Recovery = 200mA (Io), and the Diode Type is Standard, and Current Reverse Leakage Vr is 20μA @ 600V, and the Voltage Forward Vf Max If is 1.5V @ 10A, and Voltage DC Reverse Vr Max is 600V, and the Current Average Rectified Io is 10A, and Reverse Recovery Time trr is 35ns, it has an Operating Temperature Junction range of -55°C ~ 150°C, and Pd Power Dissipation is 30 W, it has an Maximum Operating Temperature range of + 150 C, it has an Minimum Operating Temperature range of - 55 C, and the Vf Forward Voltage is 1.3 V, and Vr Reverse Voltage is 600 V, and the Ir Reverse Current is 1.5 mA, and If Forward Current is 10 A, and the Max Surge Current is 100 A, and Recovery Time is 35 ns.

DFD0902F0947A with user guide manufactured by SAMSUNG. The DFD0902F0947A is available in SMD Package, is part of the IC Chips.

DFD2N60 with circuit diagram manufactured by DI. The DFD2N60 is available in TO-252 Package, is part of the IC Chips.

DFD8902 with EDA / CAD Models manufactured by DBL. The DFD8902 is available in DIP18 Package, is part of the IC Chips.