The STM32F413xG/H devices are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32F413xG/H devices belong to the STM32F4 access product lines (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F413xG/H devices incorporate high-speed embedded memories (up to 1.5 Mbytes of Flash memory, 320 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer a 12-bit ADC, two 12-bit DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timer for motor control, two general-purpose 32-bit timers and a low power timer.
They also feature standard and advanced communication interfaces.
1.7 V to 3.6 V power supply
-40 °C to 85/105/125 °C temperature range
Core: Arm 32-bit Cortex-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
Memories
Up to 1.5 Mbytes of Flash memory
320 Kbytes of SRAM
Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
Dual mode Quad-SPI interface
LCD parallel interface, 8080/6800 modes
Clock, reset and supply management
1.7 to 3.6 V application supply and I/Os
POR, PDR, PVD and BOR
4-to-26 MHz crystal oscillator
Internal 16 MHz factory-trimmed RC
32 kHz oscillator for RTC with calibration
Internal 32 kHz RC with calibration
Power consumption
Run: 112 μA/MHz (peripheral off)
Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ.; 80 μA max @25 °C
Stop (Flash in Deep power down mode, slow wakeup time): 15 μA Typ.; 46 μA max @25 °C
Standby without RTC: 1.1 μA Typ.; 14.7 μA max at @85 °C
VBAT supply for RTC: 1 μA @25 °C
2x12-bit D/A converters
1×12-bit, 2.4 MSPS ADC: up to 16 channels
6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support
General-purpose DMA: 16-stream DMA
Core Processor
ARM? Cortex?-M4
Core Size
32-Bit
Speed
100MHz
Connectivity
CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SDIO, QSPI, SAI, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O
114
Program Memory Size
1.5MB (1.5M x 8)
Program Memory Type
FLASH
RAM Size
320K x 8
Voltage Supply (Vcc/Vdd)
1.7V ~ 3.6V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40??C ~ 85??C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
ModelsDescriptionOperation
STM32F413ZHJ6Microcontroller, ST, 144-UFBGACompare
STM32F412VET6TRMicrocontroller, ST, LQFP100Compare
STM32F412VGH6Microcontroller, ST, 100-UFBGACompare
STM32F413RHT6Microcontroller, ST, 64-LQFPCompare
STM32F412VGT6Microcontroller, ST, 100-LQFPCompare
STM32F413RGT6Microcontroller, ST, 64-LQFPCompare