Small mold package.
High reliability.
Diode Configuration
Series
Maximum Forward Current
300mA
Mounting Type
Surface Mount
Number of Elements per Chip
2
Maximum Reverse Voltage
80V
Package Type
UMD
Diode Technology
Silicon Junction
Pin Count
3
Maximum Forward Voltage Drop
1.2V
Maximum Diode Capacitance
3.5 pF @ 6 V
Maximum Operating Temperature
+150 °C
Length
2mm
Width
1.25mm
Height
0.9mm
Dimensions
2 x 1.25 x 0.9mm
Power Dissipation
200mW
ModelsDescriptionOperation
DAM1MA18HITHCHI, SMACompare
DAM1MA27Zener Diodes, HITACHI, SOD-6Compare
DAM3MA47HATACHI, SMD-47VCompare
DAN202KROHM, SOT-23Compare
DAN202USubminiature tubes, ROHM, SOT-323Compare
DAN217Signal Diodes, ROHM, SOT-23Compare
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Instant Messaging
7*24 hours hotline
Catalogue
FPGA / CPLD
Memory
MOS 
MCU 
DSP
OCEP
Secondary 
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