
MCU 32-bit ARM Cortex M0 RISC 128KB Flash 2.5V/3.3V/5V 56-Pin QFN EP Tray
Manufacturer :
Cypress Semiconductor Corp
Package/Case :
QFN-56
Product Categories :
Microcontrollers
Datasheet:
CY8C4247LQI-BL463 PDF
RoHs Status:
Lead free/RoHS Compliant
In-stock:
450
Bluetooth portfolio consists of Bluetooth Low Energy (BLE)-only and dual-mode Bluetooth solution that supports Bluetooth Classic i.e. Basic Rate (BR) and Enhanced Data Rate (EDR) as well as BLE. Bluetooth Low Energy (BLE) portfolio consists of WICED SMART, PSoC 4 BLE and PSoC 6 BLE System-on-Chip (SoC) devices and System-in-Package (SiP) modules. The dual-mode Bluetooth portfolio includes Bluetooth 5.0 core specification-compliant, BR + EDR + BLE devices and modules that integrate Bluetooth standard profiles and protocols for embedded applications. All of Bluetooth Modules are fully integrated, fully certified, programmable modules designed for ease-of-use and reducing time-to-market.
latest, CYW20819, is a best-in-class Bluetooth 5 single-chip solution targeted at Bluetooth Mesh, audio, voice, wearables, mice, keyboards, gaming consoles, remote controls, home automation, and a wide range of other Internet of Things (IoT) applications. The CYW20819 fully implements the Bluetooth Mesh 1.0 specification, and employs the highest level of integration to eliminate external components, allowing device makers to reduce product footprints and slash costs.
The CYW20819 integrates Ultra-Low Power (ULP) BLE along with the capability to add audio functionality to enhance the user experience for wearables and trackers. It also provides best-in-class receiver sensitivity for both BLE and EDR. Using advanced design techniques and process technology to reduce active and idle power, the CYW20819 also addresses the needs of a diverse class of low power Bluetooth 5-enabled devices that require minimal power consumption and compact size.
Core Processor
ARM? Cortex?-M0
Core Size
32-Bit
Speed
48MHz
Connectivity
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals
Bluetooth, Brown-out Detect/Reset, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O
36
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
RAM Size
16K x 8
Voltage Supply (Vcc/Vdd)
1.71V ~ 5.5V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40??C ~ 85??C (TA)
Mounting Type
Surface Mount
Package / Case
56-UFQFN Exposed Pad
Supplier Device Package
56-QFN (7x7)
ModelsDescriptionOperation
LPE12000-M8INTEL, 8GB/SCompare
HI1101GWCHISILICON, BGACompare
GPMQ9019BGENERAL, LQFP48Compare
800402GJ-211ROLAND, QFPCompare
MT25QL02GCBBMICRON, TBGA-24Compare
ACMD-6007-BLKAVAGO, QFNCompare