| RoHS | Exempt |
|---|---|
| REACH | Yes |
| Lead finish / Ball material | NIPDAU |
| MSL rating / Peak reflow | Level-3-245C-168 HR |
| Material content | View |
| DPPM / MTBF / Fit rate | View |
| Qualification summary | View |
| Ongoing reliability monitoring | View |
| Device marking | View |
Parametrics
Technical documentation
Design & development
Support & training
| Package | Pins | Package qty | Carrier | Operating temperature range (°C) |
|---|---|---|
| B1QFN (RUQ) | 47 | 500 | LARGE T&R Custom reel may be available | -40 to 85 |
Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design
Efficiencies Up To 96%
Wide-Output Voltage Adjust
0.6 V to 5.5 V, with 1% Reference Accuracy
Supports Parallel Operation for Higher Current
Optional Split Power Rail allows
input voltage down to 1.6 V
Adjustable Switching Frequency
(250 kHz to 780 kHz)
Synchronizes to an External Clock
Adjustable Slow Start
Output Voltage Sequencing and Tracking
Power Good Output
Programmable Undervoltage Lockout (UVLO)
Output Overcurrent Protection (Hiccup Mode)
Overtemperature Protection
Prebias Output Start-up
Operating Temperature Range: –40°C to +85°C
Enhanced Thermal Performance: 13°C/W
Meets EN55022 Class B Emissions
Design Help visit http://www.ti.com/TPS84621
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The TPS84621 is an easy-to-use integrated power solution that combines a 6-A DC-to-DCconverter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. Thistotal power solution allows as few as three external components and eliminates the loopcompensation and magnetics part selection process.
The 9×15×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows acompact point-of-load design with greater than 90% efficiency and excellent power dissipation witha thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated outputcurrent at 85°C ambient temperature without airflow.
The TPS84621 offers the flexibility and the feature-set of a discrete point-of-loaddesign and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford arobust and reliable power solution compatible with standard QFN mounting and testingtechniques.